Investor Relations

Investor Relations

Corporate Profile

STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets. With a broad technology portfolio ranging from leadframe and laminate packages to advanced fan-out and fan-in wafer level technology, flip chip interconnect, System-in-Package (SiP), Through Silicon Via (TSV) and 2.5D/3D packagi... More >>

Recent News

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11/18/15STATS ChipPAC Ltd. Announces Pricing of New Senior Secured Notes
11/09/15STATS ChipPAC Ltd. Announces Proposed Private Placement of New Senior Secured Notes
10/16/15STATS ChipPAC Ltd. announces expiration and final results of its change of control offer for the existing notes
10/13/15STATS ChipPAC Ltd. Announces Expiration and Final Results of its Tender Offer for the Existing Notes
09/30/15STATS ChipPAC Ltd. announces its election to exercise early purchase option and the early settlement date

Featured Documents

Financial Statements and Related Announcement
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2014 Annual Report
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Stock Information

Shareholder Calendar

May 2016?
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Shareholder Tools

Primary IR Contact

Low Yen Ling
Director, Corporate Finance
Phone: (65) 6824 7788
Fax: (65) 6720 7826
E-mail: Low Yen Ling