Investor Relations

Investor Relations

Corporate Profile

STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets. With a broad technology portfolio ranging from leadframe and laminate packages to advanced fan-out and fan-in wafer level technology, flip chip interconnect, System-in-Package (SiP), Through Silicon Via (TSV) and 2.5D/3D packagi... More >>

Recent News

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09/30/15STATS ChipPAC Ltd. announces its election to exercise early purchase option and the early settlement date
09/28/15STATS ChipPAC Ltd. announces early results of the tender offer and consent solicitation for its Existing Notes
09/04/15STATS ChipPAC Ltd. Announces: (1) Tender Offer and Consent Solicitation in Respect of the Existing Notes, and (2) Change of Control Offer for the Existing Notes
08/05/15STATS ChipPAC Appoints New Chief Financial Officer
08/05/15STATS ChipPAC Appoints Co-President and Chief Executive Officer

Featured Documents

Financial Statements and Related Announcement
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STATS ChipPAC Reports First Quarter 2015 Results
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2014 Annual Report
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Stock Information

Shareholder Calendar

October 2015?
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Shareholder Tools

Primary IR Contact

Low Yen Ling
Director, Corporate Finance
Phone: (65) 6824 7788
Fax: (65) 6720 7826
E-mail: Low Yen Ling